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China's chip capabilities just 3 years behind TSMC, teardown shows
(asia.nikkei.com)
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this post was submitted on 31 Aug 2024
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An EUV laser blasting at 1 kW is gonna absolutely chew through optical components. I hope they're making some serious advances in materials science. Contemporary components like mirrors, attenuators, filters, etc start degrading when you blast them with more than 1W of DUV.
I guess it could just be written up as cost of operation, but yeah would be curious to see if components can be made that withstand this much abuse without degradation for long periods.
I mean, as-is with much lower power lasers, it's written up as a cost of operation. What used to be parts that were installed once and then never touched are now regular maintenance tasks.
I don't think the mirrors and prisms will be the expensive part in the grand scheme of things, but the downtime to shift spots and replace components will be expensive.
Makes sense yeah, presumably this stuff has to be incredibly finely tuned to work right.
Possible they're leveraging reduced complexity and their local manufacturing and vertical integration to just replace ad hoc. Component breaks just slot in a new one.
As I just posted to Yogthos, it's the downtime that will be costly here. The mirrors and prisms can be made cheaply enough when you take China's supply chain and large scale manufacturing into account, but the loss of production will have to be reduced somehow. Lasers require incredible precision; the difference between just barely touching the allen wrench and not can make the beam go from centered on target to completely off the detector. This translates to hours of tedious adjustments to get the beam back on target, even with alignment pins.
Yeah, good point, training up German Sphere Guy levels of skill will take time.