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this post was submitted on 18 Feb 2024
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Yeah the framing there is kinda silly, but it does seem like the whole fab reshoring thing has been plagued with problems. The more interesting parts of the article were that the time to build fabs is increasing, especially in recent times
and the number of fabs overall is at all time low
It's also not just a month difference for the delays
And there are a couple of related data points from TSMC and Samsung regarding fab construction
https://www.tomshardware.com/tech-industry/us-government-doles-out-paltry-dollar35-million-of-the-dollar52-billion-chips-act-warns-of-possible-delays-in-intel-and-tsmc-fab-buildouts
https://www.tomshardware.com/tech-industry/semiconductors/us-govts-sluggish-chips-act-payouts-slam-the-breaks-on-samsungs-fab-company-delays-mass-production-at-texas-fab-to-await-further-chips-funding-report
So, while I agree that EPA regulation isn't the core problem here, I think it's pretty clear that US is having trouble with the whole reshoring idea.
TSMC got delayed because the local union demanded they stop replacing them with foreign workers and Samsung is delaying their construction because they're fighting with Intel for subsidies.
Lol and we call these companies "job creators" when we have to fight them to even hire us. And why can't Samsung pull themselves up by their bootstraps and free market themselves a factory, hmmm? 🤔
In Poland we call it "Szajsung" from German "scheisse", because in 90's we were flooded with their products which were drastically less reliable than what we were used to from Polish, Soviet and East German house aplliances and electronics.
I imagine another factor is that they don't really want to move fabs to US either.
This is what I was told by a coworker who had been in the semiconductor industry for decades (can't ask him for sources now because he's dead):
During the Obama administration, they set up a tax cut to incentivize companies to build more factories, where you would get a tax break if you filed plans within a certain time frame, but you only needed to build one building to take advantage of it on the planned future construction. As an example, Intel slowly built a new fab in Arizona, and, once it was completed, they left it empty for years, only starting to install equipment in 2019. This facility was also built with the move to 450mm wafers in mind, so it was much larger than previous fabs. The move to 450mm wafers never happened, and probably never will.
A big part of the speed is the extremely poor mid to long term planning. Constant rework because of constantly changing demands, slashing workforces during slow periods and then struggling to fill positions long after they should have been filled, and more bullshit as you can imagine.
This was a really great read on the subject as well, it mentions how fab facilities built for one generation of chips can't easily be reused for another because the process changes so much. So, yeah those 450mm facilities are basically useless at this point. https://compactmag.com/article/fighting-a-chip-war-on-the-cheap