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this post was submitted on 18 Jun 2023
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It's usually not silicon on the PCB that fails, but the other electronic components (usually the capacitors) that fails first, and since they are surface mounted devices it's really difficult to solder them by hand.
There are no electrolytics in phones, and most newer phones don't even have tantalums. So long as there are no flexing stresses induced, which is nearly impossible with the way phones are constructed now, the all MLC capacitors construction has the potential to outlast any PC motherboard or laptop by a large margin.
The most critical issue is board connectors and moisture ingress. The USB-C connector or any other high pin density micro sized connector with a tiny pin pitch, and large electrical potential will fail from charge cycling and a resistance forming between pins. USB-C is particularly bad because reversing the connector doubles the number of pins on the board in a ridiculous amount of space. Just using a standard USB-C connector when ordering a prototype to be fabed at any common board house will double the price. The USB-C pin pitch is too tight for the most common fab process resolution.