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I wasn’t trying to imply that. When I said “frying the chip” I meant through bad thermal coupling.
You’re the first person to suggest that, and frankly, I find that counterintuitive. Everything isolates if it’s thick enough. However I’ll also look into that someday and see if there’s something to it. Thanks again.
Your correct that thickness plays a role in theremal transfer, but the paste and amount you use is not what determines that gap. Both laptop and desktop heatsinks are under quite a bit of pressure, more than enough to squish out extra paste. If you want to be extra sure you can spread a thin layer across the entire chip, but a dot or two usually works just fine. This video is on desktop coolers but mounting pressure should be similar.
If your laptop is over a couple years old I can almost guarantee there are dry spots on the chip currently. Laptops already run pretty hot and it's a double whammy for drying and pump out.