This Modular Phone Concept Is Xiaomi’s Plan to Kill the Camera Bump (www.wired.com)

submitted 3 months ago by along_the_road@beehaw.org to c/technology@beehaw.org

11 comments fedilink hide all child comments

you are viewing a single comment's thread
view the rest of the comments

[-] along_the_road@beehaw.org 14 points 3 months ago

Looks like this:

Key to its success is Xiaomi’s LaserLink technology. This is a proprietary optical communication module, apparent as a small dot on the back of the phone and the lens where data is transferred as light (near-infrared laser) at speeds of up to 10 Gbps.

The lens has two pins that connect on the back to draw power from the phone

[-] datavoid@lemmy.ml 2 points 3 months ago

Now with flash bump!

this post was submitted on 03 Mar 2025

42 points (100.0% liked)

Technology

39308 readers

352 users here now

A nice place to discuss rumors, happenings, innovations, and challenges in the technology sphere. We also welcome discussions on the intersections of technology and society. If it’s technological news or discussion of technology, it probably belongs here.

Remember the overriding ethos on Beehaw: Be(e) Nice. Each user you encounter here is a person, and should be treated with kindness (even if they’re wrong, or use a Linux distro you don’t like). Personal attacks will not be tolerated.

Subcommunities on Beehaw:

This community's icon was made by Aaron Schneider, under the CC-BY-NC-SA 4.0 license.

founded 3 years ago

MODERATORS

alyaza@beehaw.org

TheRtRevKaiser@beehaw.org

gyrfalcon@beehaw.org

rs5th@beehaw.org

coldredlight@beehaw.org

SemioticStandard@beehaw.org

TheRtRevKaiser@kbin.social

remington@beehaw.org